When Green-Laser 3D Printing Meets 600 kW Compute Cooling: FASTFORM at the Liquid Cooling Summit
Key takeaways AI chip heat output is projected to grow 4× between 2023 and 2027, with heat loads roughly doubling every six months. Air cooling stalls at about 35 kW per rack; chilled-water systems stretch to roughly 55 kW. Everything above that is the industry’s “thermal cliff.” The root problem is heat exchange area per unit volume — and that is precisely […]