DeskFab X1
FF-M140
FF-M220
FF-M300
FF-M420
FF-M800
Mabapi le rona
Paltform e bohlale ea indasteri ea Fastlayer e kopanya meralo e bulehileng le li-algorithms tse tsoetseng pele tsa AI ho theha setsi sa ts'ebetso ea datda se bohareng. Tlhahiso ena e nolofalletsa phetoho ea bohlokoa ho tloha ho "ho latela phihlelo"ho "e tsamaisoang ke data" tlhahiso. e fumana litokelo tsa molao tse 38 tsa lehae le tsa machabeng. Litharollo tsa FastForm joale li matlafatsa phetoho ea dijithale ho pholletsa le tlhokomelo ea bophelo bo botle, lisebelisoa tsa elektroniki tsa bareki, sebaka sa lifofane le makala a mang a tsoetseng pele a tlhahiso. Ka hoo e ka bang 3,000 litsamaiso tse kentsoeng lefatšeng ka bophara, lihlahisoa tsa FastForm li fihlella bareki ba fetang 80 linaha.
CEO le CTO
Ph.D. ho Boenjiniere ba Mekaniki le ba Lifofane ho tsoa Univesithing ea Theknoloji ea Nanyang, lengolo la Bachelor ho Thepa le Taolo ea Lisebelisoa ho tsoa Univesithing ea Saense le Theknoloji ea Huazhong.
Ke ithutile tlas'a Moprofesa Shi Yusheng, e mong oa bo-pula-maliboho ba lipatlisiso tsa khatiso ea 3D Chaena, ka boiphihlelo bo bongata ba botekgeniki le phihlello ea mehloli e mengata ea botekgeniki le marang-rang.
Rakhoebo ea tsamaeang ka letoto, ea nang le mesebetsi e fetileng ho kenyeletsoa Mothehi, CTO, le boikarabello bo felletseng nts'etsopele ea lihlahisoa, boenjiniere ba lits'ebetso, le katoloso ea 'maraka ho Fastform.
Mongoli oa lipampiri tsa thuto tse fetang 10 mabapi le khatiso ea 3D, litokelo tsa molao tse ka bang 10 tsa boqapi, le buka e le 'ngoe ea thuto.
Moqapi oa pele oa lisebelisoa tsa khatiso tsa SLM tse nang le lihlooho tse peli tse hlahisitsoeng ka hare ho naha ka litokelo tse felletseng tsa thepa ea kelello Chaena ka 2017.
Har'a bahlahisi ba pele ba lisebelisoa tsa SLM tse hlahisitsoeng ka tlung tsa 4-head Chaena ka 2020.
Har'a bahlahisi ba pele ba lisebelisoa tsa SLM tse entsoeng ka tlung tsa octuple-head Chaena ka 2021.
Mothehi-'moho/Moqapi e Moholo oa Software (CIO), Setsebi se Seholo sa Software Architect (CSA):
Ph.D. ho Boenjiniere ba ho Sebetsa Lisebelisoa ho tsoa Univesithing ea Saense le Theknoloji ea Huazhong, Ph.D. ho Boenjiniere ba Mekaniki ho tsoa Univesithing ea Loughborough UK, lengolo la Bachelor ho Boenjiniere ba ho Etsa le ho Laola Lisebelisoa ho tsoa Univesithing ea Saense le Theknoloji ea Huazhong.
Rakhoebo ea qothisanang lehlokoa, ea nang le mesebetsi e fetileng ho kenyeletsoa le moqapi oa software ho Guosheng Precision, moenjiniere oa software oa 3D ho Yishi, le moenjiniere ea ka sehloohong oa software ho Meiguang Sufast.
Phihlelo ea lilemo tse fetang 10 nts'etsopele ea theknoloji ea software le sistimi ea taolo.
Mong'a litokelo tsa molao tsa software tse fetang 10, mongoli oa lipampiri tse 'maloa tsa thuto mabapi le li-algorithms tsa taolo ea khatiso ea 3D.
Mongoli a le mong oa mela e fetang 400,000 ea khoutu ea software, ka menehelo ea mantlha e kenyeletsang li-algorithms tse kholo tsa ntlafatso ea sebopeho sa ho roka le li-algorithms tse nang le likhoele tse ngata tse tsamaeang hammoho.
Moqapi oa pele oa software ea khatiso ea tšepe ea SLM 3D e hlahisoang ka hare ho naha Chaena, e akaretsang li-algorithms tsa ho seha le taolo ea ts'ebetso.
Motho ea hlahelletseng lefapheng la software ea khatiso ea 3D, hangata o bapisoa le Zhang Xiaolong oa Univesithi ea Huazhong.
Moenjiniere e Moholo oa Motlakase:
Degree ea Bachelor ho Boenjiniere ba Puisano ho tsoa Univesithing ea Boenjiniere ba Tlhahisoleseling ea PLA. Pele o ne a sebetsa Foxconn joalo ka Moenjiniere oa Kopo ea Masimo (FAE) bakeng sa mohala oa tlhahiso oa WLBG Nokia le mohala oa tlhahiso oa iPhone oa iDPBG. Ha a le ShenZhou Tengyao, o sebelelitse e le moenjiniere oa liteko, a kenya letsoho mererong e kang nts'etsopele ea mochini oa liteko oa UAT bakeng sa mohala oa tlhahiso ea liteko tsa iPhone, lipatlisiso tsa OIS lilaboratoring tsa Nokia, le Morero oa Khamera e 'Meli lilaboratoring tsa Nokia.
Ke keneletse ntshetsopeleng ya theknoloji ya kgatiso ya 3D ho tloha ka 2014, ke ikgethile ka ditsamaiso tsa taolo ya elektroniki le ya motlakase. Ke ikarabella bakeng sa ntshetsopele ya diprinta tsa FDM, diprinta tsa SLA, diprinta tsa DLP, diprinta tsa tshepe tsa SLM, le meralo e meng ya taolo ya elektroniki. Ke bokelletse boiphihlelo bo bongata ba thuto le bo sebetsang indastering ya kgatiso ya 3D.
Molekane oa Leano:
Degree ea Master ho Thepa ea Saense ho tsoa Beihang University (BUAA). Pele o ne a le maemong a mookameli oa projeke bakeng sa projeke ea khatiso ea 3D ho Nanjing Zhongke Yuchen Laser, Motlatsi oa Mopresidente oa Investment Banking ho AVIC Securities (Moemeli oa Motšehetsi), Motsamaisi oa Matsete ho Tianfeng Securities, le Motsamaisi e Moholo oa Leano (CSO) le Molekane oa Motheo ho GW Laser. O bokelletse boiphihlelo ba lilemo tse 10 indastering le tsamaisong, hammoho le boiphihlelo ba lilemo tse 10 theknolojing ea laser, indastering, 'marakeng le ts'ebetsong ea maano. O etelletse pele merero 'marakeng, leanong le ts'ebetsong ea motse-moholo ea li-laser le lisebelisoa tsa laser, ka chelete e kopaneng ea RMB e fetang bilione e le' ngoe.
Motsamaisi oa Papatso
Univesithi ea Shandong - Degree ea Bachelor ho boenjiniere ba mechini le motlakase. O sebelelitse ka tatellano e le motsamaisi oa tekheniki oa covergent-photonics Asia Pacific ho Prima Group Italy Amerika Leboea, le motsamaisi oa papatso ea kantle ho naha ea GW LASER. Lilemo tse 12 tsa boiphihlelo indastering ea laser le theknoloji ea laser, o tloaelane le 'maraka oa laser oa lefats'e. Ka boiphihlelo bo bongata ba ho nts'etsapele baemeli ba lisebelisoa tsa laser tsa lefats'e, li-integrators, lits'ebetso tsa laser tsa terminal, jj.